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ELECTRICAL TEST SOCKETS FOR BGA DEVICES

IP.com Disclosure Number: IPCOM000009006D
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Jul-31

Publishing Venue

Motorola

Related People

Authors:
Mack W. Johnson Jr. James Gary Mosier Darcy Laveau

Abstract

Reliably testing tine pitch BGA (Ball Grid Array 1.0 and .8 mm pitch) devices in initial test software development phase and final manufacturing test environment. There are two problems in testing these new packages. First is that the outside pack- age outline does not allow sufficient accuracy to align the ball grid array to the contacts. The total position accuracy of the solder array with respect to the outside edges is ,275 mm and the solder ball diameter of only .42 mm +/- .08 means you cannot use the package outline to properly position the device in the contacts. Off centered contact causes poor electrical contact or no contact and can cause contact element damage.