COST EFFECTIVE HEATSINKING FOR SMT ELECTRONICS
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Jul-31
Heatsinking has always been one of the main challenges in the mechanical design of electrical systems such as engine management modules. A cost-effective solution to dissipate the heat of SMT components on FR4 substrate had to be developed considering the following requirements: wide) were used, but different features were devel- oped to optimize the quality of the contact: the bottom metal part can be curved to limit the effect of the bending 'due to screwing and allow a good pressure even in the middle part of the con- tact area.