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WAFER FRAME DEVELOPMENT FOR TWO-DIRECTIONAL WAFER LOADING IN X-CELL DIE BONDING

IP.com Disclosure Number: IPCOM000009035D
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Aug-02

Publishing Venue

Motorola

Related People

Authors:
Chang D.W Kim K.M Park David

Abstract

Because of the acceleration sensing die char- acteristics, X-lateral accelerometer wafer is fahri- cated with the crossed mask unlike other general wafer (showed in Figure 1) during its manufactur- ing process. The current die bond machine in X -lateral was designed for picking and bonding the general pattern die not the crossed (reversed) pattern die. Therefore, operators have to do parame- ter setting twice per one wafer die bonding in order to pick the crossed pattern dice of X-cell wafer (the reversed dice).