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A Flexible Circuit Circulator/Isolator Disclosure Number: IPCOM000009060D
Original Publication Date: 2002-Aug-05
Included in the Prior Art Database: 2002-Aug-05

Publishing Venue


Related People

Robert R. Kornowski Daniel J. Buntley Paul W. Steder


Circulators/Isolators are commonly employed in Solid State R.F. (Radio Frequency) P.A. (Power Amplifier) Assemblies to protect the active devices in the amplifier output circuitry from the potentially damaging effects of load malfunction. Circulators/Isolators are also used to reduce the magnitude of reverse-traveling interfering signal energy that can play against the nonlinearity of the power amplifier output device/s and thereby produce I.M.D. (Intermodulation Distortion). The associated circuit topology in this Isolator/Circulator application environment is typically comprised of planar microstrip structures that have co-resident R.F. "hot" and R.F. ground conductor systems wherein all of these constructions are collectively attached to a common heat sink structure. Owing to the physical mass and dissipation factor of a high power (200 Watt) Circulator's/Isolator's ferrous junction, and to the heat that is dissipated by the Circulator's/Isolator's load resistor when responding to a fault condition, the Circulator's/Isolator's housing design and electrical interconnection schemes end up being constrained to the point that R.F. functionality is compromised in order to accommodate the need for secure mounting and adequate heat sinking. The C.T.E. (Coefficient of Thermal Expansion) differences that typically exist in such application environments also necessitates some means of mediation to assure long-term reliability. Collectively, these conditions result in compromised designs wherein the R.F. ground current is conveyed through less than ideal "nut-and-bolt" conduction pathways and the R.F. "hot" current is conveyed through delicate inductive interconnection devices ("Omega Straps") that provide the physical compliance which is needed to reconcile the systemic C.T.E. differences (see Figure 1).