Browse Prior Art Database

NOVEL HEAT SINKING TECHNIQUES

IP.com Disclosure Number: IPCOM000009075D
Original Publication Date: 1999-Jun-01
Included in the Prior Art Database: 2002-Aug-06

Publishing Venue

Motorola

Related People

Authors:
Philip Burrus Holley Renfro

Abstract

As technology continues to advance, modern semiconductor devices continue to get smaller in size. For small signal devices, this is highly advanta- geous, as electronic devices are able to compress more features into smaller packages. In power elec- tronics however, the reduction in size is a double- edged sword. While the reduction in size enables designers to develop smaller products, these new products are still required to supply the same amounts of power as their larger predecessors. Further, the losses associated with power electronics tend to generate heat, and with the smaller compo- nents produce higher heat densities.