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Method for hybrid BGA, SMT, and THM leads for solder-joint reliability enhancement

IP.com Disclosure Number: IPCOM000009094D
Publication Date: 2002-Aug-07

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for hybrid ball grid array (BGA), surface-mount technology (SMT), and through-hole mount (THM) leads for solder-joint reliability enhancement. Benefits include improved reduction of defects.