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Segmented Glob Reinforcement for Extra Long Fine Pitch Wire Bond

IP.com Disclosure Number: IPCOM000009246D
Original Publication Date: 2002-Aug-13
Included in the Prior Art Database: 2002-Aug-13

Publishing Venue

Motorola

Related People

Authors:
Fuaida Harun LC Tan CS Foong

Abstract

The invention being disclosed here involves the use of single or multiple segmented reinforcement to hold long multi-tier and/or staggered ultra fine pitch wire bonds in normal, stacked, or MCM packages in their places to avoid wire deformation during glob top or molding which may lead to wire shorting. The invention disclosed here encompasses the art of wire bonding IC packages in very general terms, without reference to any specific package type. The segmented glob epoxy reinforcement can be applied to small and strategic location of the wires. The globbed epoxy can be held suspended on the wires or dispensed through the wire to the solder mask at the bottom. For extra long wires, multiple glob segments may be used for additional reinforcement. The globbed epoxy does not contact the dies.