WAFER FRAME DEVELOPMENT FOR TWO-DIRECTIONAL WAFER LOADING IN X-CELL DIE BONDING
Original Publication Date: 1999-Jun-01
Included in the Prior Art Database: 2002-Aug-14
Because of the acceleration sensing die charac- teristics, X-lateral accelerometer wafer is fabricated with the crossed mask unlike other general wafer (shown in Figure 1) during its manufacturing process. The current die bond machine in X-lateral was designed for picking and bonding the general pattern die not the crossed (reversed) pattern die. Therefore, operators have to do parameter setting twice per one wafer die bonding in order to pick the crossed pattern dice of X-cell wafer (the reversed dice).