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Disclosed is a method for an integrated core stiffener for the internal mechanical support of flip-chip microelectronic packages. Benefits include equal or improved performance at reduced cost.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
61% of the total text.
Method for an integrated core stiffener for the internal
mechanical support of flip-chip microelectronic packages
Disclosed is a method for an integrated core stiffener for the
internal mechanical support of flip-chip microelectronic packages. Benefits include
equal or improved performance at reduced cost.
� � � � � Flip-chip packages
using thinner cores such as metal-based or printed circuit board-type materials
are more flexible and less robust mechanically (especially when under loading
conditions) than thicker core counterparts.
� � � � � The conventional
method for stiffening flip-chip packages is an external stiffener plate affixed
post-assembly or the use of thicker core materials.
� � � � � The disclosed method
is an integrated stiffener used in flip-chip microelectronic package cores. The
key elements of the method include:
Flip-chip microelectronic packages
Use of an integrated stiffener within the package core
� � � � � An integrated
stiffener can be designed into the core material with little or no impact on
electrical performance and at minimal cost. This method is particularly
advantageous with thin core packages where external stiffening is required and
with metal-based core materials that can be routed or shaped during the etch steps
typical of the conventional process. Using the disclosed method, external
stiffener devices may not be required, reducing package cost. Via pitch and
depth can also be maintained or i...