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Method of fabrication of solder balls and attachment to package/board substrates

IP.com Disclosure Number: IPCOM000009293D
Publication Date: 2002-Aug-14
Document File: 6 page(s) / 90K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of fabrication of solder balls and attachment to package/board substrates. Benefits include improved ease of manufacturing.