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Method for the use of reverse copper dot meshing on MMAP strips to minimize warpage on thin-core substrates

IP.com Disclosure Number: IPCOM000009297D
Publication Date: 2002-Aug-14

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the use of reverse copper dot meshing on molded matrix array package (MMAP) strips to minimize warpage on thin core substrates (less than or equal to 100 µm). Benefits include improved reliability.