ALUMINUM SILICON CARBIDE PHASE CHANGE HEAT SPREADER
Original Publication Date: 1999-Jun-01
Included in the Prior Art Database: 2002-Aug-16
An RF power module for telecom applications is typically built-up on a carrier plate, and multiple modules are attached to a heatsink to produce a power amplifier. In general, RF modules cannot be built-up directly on current heatsinks as the coeffi- cient of thermal expansion (CTE) mismatch between the RF circuit material and the heatsink material would yield prohibitively high thermally induced stresses. Therefore, the function of a carrier plate in this application is to match the CTE of the RF circuit and provide a good thermal path from the RF power devices to the heatsink. With the increase in power dissipation and the decrease in footprint for newer RF power devices, the temperature rise from the heataink to the device will increase to the point that the device maximum temperature can be exceeded.