Dismiss
InnovationQ will be updated on Sunday, September 22, from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

MULTI CHIP DIE BONDER WITH WAFER POSITIONING STAGE OPERATING SOFTWARE

IP.com Disclosure Number: IPCOM000009420D
Original Publication Date: 1999-Sep-01
Included in the Prior Art Database: 2002-Aug-22
Document File: 2 page(s) / 92K

Publishing Venue

Motorola

Related People

Authors:
Brian T. Albrecht Mike Eleff

Abstract

The current eutectic die attach procedure for RF devices on the Multi Chip Die Bonder is a very time- consuming and tedious process. A majority of the process is performed manually by an operator. Since operations performed by the operator are sequential, throughput is low and variable based on operator skill. It would be beneficial to automate the critical operations to improve quality and increase parallel operations.