MULTI CHIP DIE BONDER WITH WAFER POSITIONING STAGE OPERATING SOFTWARE
Original Publication Date: 1999-Sep-01
Included in the Prior Art Database: 2002-Aug-22
The current eutectic die attach procedure for RF devices on the Multi Chip Die Bonder is a very time- consuming and tedious process. A majority of the process is performed manually by an operator. Since operations performed by the operator are sequential, throughput is low and variable based on operator skill. It would be beneficial to automate the critical operations to improve quality and increase parallel operations.