WAFER POSITIONING STAGE WITH LOW PROFILE THETA ACTUATOR
Original Publication Date: 1999-Sep-01
Included in the Prior Art Database: 2002-Aug-22
Eutectic die attach of RF super high tech devices is often a complex and tedious semi-manual operation. At the die attach stage of the final assem- bly process of RF devices, there can be as many as eight separate components attached to the same header or substrate. This causes low throughput and increased chances for non-conforming product. The current process uses a Multi Chip Die Bonder that relies on an operator to perform both the die and header alignment. First, the operator aligns a die into a reference box displayed on a monitor and then presses a button to initiate the pickup process. After the die has been picked, the operator aligns the next die for pickup. This is repeated until all of the dies have been picked. The operator will then manually align the header or substrate to the reticule lines dis- played on a second monitor and then press a button to initiate the bonding sequence. While the bonding sequence is in process, the operator can only locate one die.