BALL GRID ARRAY (BGA) X-RAY IDENTIFICATION
Original Publication Date: 1999-Sep-01
Included in the Prior Art Database: 2002-Aug-23
The testing of electronic assemblies is becoming more and more complex due to the smaller compo- nents being used. The industry standard for initial test has been In-Circuit test, however test point access is becoming extremely difficult to achieve. Alternative test and inspection methods are being investigated for process verification. One of these new techniques is Ball Grid Array (BGA) identifica- tion by X-ray inspection. Although X-ray is good for establishing that a component is not fitted or that a problem exists with the solder joint, it cannot determine the orientation of many of today's elec- tronic packages such as BGA's, QFP's & SIOC's. Therefore the problem exists of finding a solution of how package orientation can be detected using x-ray inspection.