Browse Prior Art Database

3D ADHESION USING VIA HOLES

IP.com Disclosure Number: IPCOM000009467D
Original Publication Date: 1999-Sep-01
Included in the Prior Art Database: 2002-Aug-27

Publishing Venue

Motorola

Related People

Authors:
Ian Hodgson Steve Jordan

Abstract

During solder reflow indiscriminate delamina- tion of thin FR4 to aluminum rigidizers (utilizing Pressure Sensitive Adhesive (PSA)) is an unaccept- able problem that requires stringent quality control with no valued added content. The current contain- ment is to bake all the laminations prior to use in a static oven at 120°C for three hours followed by a one hour cooling period with the oven door open.