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Method for a hybrid solder ball pattern on BGA packages for solder-joint reliability improvement and process window expansion

IP.com Disclosure Number: IPCOM000009498D
Publication Date: 2002-Aug-28
Document File: 6 page(s) / 920K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a hybrid solder ball pattern on ball-grid array (BGA) packages for solder-joint reliability improvement and process window expansion. Benefits include improved reliability.