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Disclosed is a method for straight-edge copper meshing to fill incomplete squares with copper on matrix-molded area package (MMAP) strips. Benefits include improved reliability.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
85% of the total text.
Method for straight-edge copper meshing
to fill incomplete squares with copper on MMAP strips
Disclosed is a method for straight-edge copper meshing to fill
incomplete squares with copper on matrix-molded area package (MMAP) strips. Benefits include improved reliability.
Delamination of the solder mask from core and
copper interfaces occurs in high-density stacked chip scale packages (HDSCSP)
using thin core (100-µm) material during reliability stress tests.
In conventional meshing, solid copper is etched
away in a meshing pattern to provide better adhesion for solder masking to base
core material. Several types of meshing patterns are in use. One type of mesh
design uses scalloped edges and incomplete square openings in the copper mesh (see
Figure 1). This approach results in the entrapment of chemicals during the
copper-plating process and poor adhesion of solder mask to core.
The disclosed method is straight-edge copper meshing with
metal-filled incomplete squares� (see Figure
2) to minimize delamination in substrates as the core thickness decreases to
meet customer requirements for thinner packages. The layers affected by
delamination include core/solder mask and copper/solder mask interfaces.
The key element of the method is straight-edge
meshing with filled incomplete squares to eliminate chemical entrapment and
improve solder mask adhesion to the core and copper.