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Method for power supply decoupling for 1-mm pitch BGA packaging

IP.com Disclosure Number: IPCOM000009506D
Publication Date: 2002-Aug-28
Document File: 6 page(s) / 312K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for power supply decoupling for 1-mm pitch ball-grid array (BGA) packaging. Benefits include improved performance.