APPLICATION OF DYNAMIC MECHANICAL ANALYZER TO WlRE/WlREBOND FATIGUE TESTING
Original Publication Date: 1999-Sep-01
Included in the Prior Art Database: 2002-Sep-04
Most electronic products use devices that contain wirebonds to make electrical interconnection to silicon die or leads external to the package. Due to the different thermal coefficients of expansion (TCE) of the various materials used within an electronic product, relative movement occurs between the various components within the product as temperature changes take place. In the case of a wirebond, this relative movement flexes the bonded wire, thereby fatiguing the wire and the bond.