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Selective Underfilling of Regions in a Flip-Chip Assembly Enabling Continued Functionality of Micro Electrical Mechanical Systems (MEMS) on Die and/or Substrates

IP.com Disclosure Number: IPCOM000009589D
Original Publication Date: 2002-Sep-04
Included in the Prior Art Database: 2002-Sep-04

Publishing Venue

Motorola

Related People

Authors:
Thomas Koschmieder Dave Mahadevan

Abstract

Micro Electrical Mechanical Systems (MEMS) are becoming more commonplace as sensors. MEMS, for example, are used as accelerometers which are used in air bag safety systems in automobiles to sense an extremely rapid deceleration (i.e. an automobile accident). Packaging the MEMS devices into electronic packages is an evolving art in itself while it uses some of the technology coming from existing packaging technology used for microprocessors and similar electronic devices.