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Thermoplastic Adhesives for Chip Scale Package (CSP) Applications

IP.com Disclosure Number: IPCOM000009591D
Publication Date: 2002-Sep-04

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using a die attach (DA) adhesive at the wafer or die level. Benefits include reducing the amount of bending or warping during die attach, wire bonding and succeeding processes.