Publishing Venue
The IP.com Prior Art Database
Abstract
Disclosed is a method for an extruded tray design for the bulk transporting of IC components and/or assembly packages. Benefits include improved throughput.
Method for an extruded tray design for the bulk
transporting of IC components and/or assembly packages
Disclosed is a method for an extruded tray design for the bulk
transporting of IC components and/or assembly packages. Benefits include improved throughput.
Background
� � � � � Component damage can
occur during the loading, storing, transporting, and unloading of IC components
or assemblies. Existing technologies include the use of injection-molded trays
(JEDEC style) in one piece and thermoformed closed-bottom versions. Industry
unloading practices for most components and assemblies are accomplished with
manual handling. Components may be loaded onto a JEDEC tray via automated
equipment, but unloading is typically done by hand. JEDEC-style trays
(injection molded or thermoformed) require tray handling that results in finger
contact on sensitive features (see Figure 1). The result can be that
unacceptable damage occurs to components or assemblies.
� � � � � Although the thermoformed version of the tray provides improvement
by preventing fingers from touching the bottom of the assembly or component,
access for removal is not improved, and the product is very difficult to remove
manually.
General description
� � � � � The disclosed method
is a low-cost design to protect IC components or assemblies during handling,
storage, and transport.
� � � � � The key elements of
the disclosed method include:
• � � � � One-piece tray designed to be extruded,
rather than injection molded or thermoformed. When two or more trays are
stacked, intercepting each other along the perimeters, they form a
semi-complete enclosure around the components contained inside. Ends are open
for component accessibility.
• � � � � Set of features that interlock the trays
when stacked and banded. The features interact so that two trays cannot shift
excessively relative to each other in y-axis or z-axis movement. X-axis
restraint is provided by an outer pack during transport and storage.
• � � � � Set of features that maintain spacing
during shipment and storage to prevent component-to-component contact, except
along two of the four component/assembly edges.
•...