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Method for the use of carbon materials for signal coupling across plane splits on PCBs

IP.com Disclosure Number: IPCOM000009598D
Publication Date: 2002-Sep-04
Document File: 4 page(s) / 44K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the use of carbon materials for signal coupling across plane splits on printed circuit boards (PCBs). Benefits include improved design flexibility and improved ease of manufacturing.