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Browse Prior Art Database

DUAL INTEGRATED CIRCUIT CONTROLLED CHIP COLLAPSE CONNECTION (C4) ONTO A LAMINATED MATRIX SUBSTRATE

IP.com Disclosure Number: IPCOM000009625D
Original Publication Date: 2000-Jan-01
Included in the Prior Art Database: 2002-Sep-05
Document File: 2 page(s) / 92K

Publishing Venue

Motorola

Related People

Authors:
Richard Greenwalt Bob LaBelle

Abstract

This paper describes a concept for the packaging of integrated circuit (IC) components which extends the application of existing manufacturing technolo- gy while providing end use customers with cost and size advantages.