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Browse Prior Art Database

HIGH-DENSITY COMPONENT REEL PACKAGES

IP.com Disclosure Number: IPCOM000009699D
Original Publication Date: 2000-Jan-01
Included in the Prior Art Database: 2002-Sep-11

Publishing Venue

Motorola

Related People

Authors:
Tan Kok Kiang Tan Oon Pheng Seow Kean Hong

Abstract

Today, over 80% of surface mounted compo- nents are packaged in a tape and reel format. In line with product and thus component miniaturization initiatives, most circuit components used today are surface mount components in 8 by 12mm tape and reel packages. This article describes how such packages can be redesigned to provide a higher den- sity of components by using more area in a tape and reel.