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LOW COST BGA ASSEMBLY

IP.com Disclosure Number: IPCOM000009746D
Original Publication Date: 2000-May-01
Included in the Prior Art Database: 2002-Sep-16

Publishing Venue

Motorola

Related People

Authors:
George Carson Lillian Thompson Dan Gamota

Abstract

Manufacturing of ball grid array (BGA) packages is composed of many steps and requires a substantial investment in capital equipment and materials. Currently, plastic substrate BGAs are the standard within Motorola. The packages have demonstrated enhanced performance in harsh environmental conditions: liquid-to-liquid thermal shock, air-toair temperature cycling, elevated temperature/high humidity/bias, drop testing, flexure, high tempera~ ture storage, high temperature operating, autoclave, and multiple reflow.