Enhanced Electrical and Thermal Performance Wirebond Package Method Using Conductive Encapsulation
Original Publication Date: 2002-Sep-16
Included in the Prior Art Database: 2002-Sep-16
Current state of the art wirebond packages suffer from high inductance of the wirebond which severely limits electrical performance. Furthermore, signal wires and ground return wires are often distant from each other, creating a large loop inductance, high characteristic impedance and performance-robbing crosstalk for the signaling. Power and ground connections to the core of the die also suffer from high impedance and inductance that can significantly curtail the operational frequency of the device. Traditional encapsulations limit the thermal performance and drive products into much costlier alternative thermal-enhanced packages such as TBGA rather than PBGA.