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FABRICATION AND STRUCTURE OF A HIGH COMPLIANCE FLIP CHIP INTERCONNECT REWORKABLE FCOB/DCA

IP.com Disclosure Number: IPCOM000009761D
Original Publication Date: 2000-May-01
Included in the Prior Art Database: 2002-Sep-17

Publishing Venue

Motorola

Related People

Authors:
Dan Gamota George Carson Cindy Melton Brian Bullock

Abstract

A non-underfilled flip chip on board (FCOB) or direct chip attach (DCA) assembly will fail due to the stresses which are generated during the expansion and contraction of the printed wiring board (PWB) during thermal cycling. The generated stress is transferred to the interconnect and a crack is initiated in the interconnect due to fatigue which will ultimately cause the IC to fail during operation. Presently the FCOB rigid interconnect is formed by the reflow of a metallurgical alloy system to connect the die bump (1/0) to a pad located on the PWB.