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Browse Prior Art Database

METHOD FOR FORMATION OF SOLDER BUMPS DIRECTLY ONTO ALUMINUM BOND PADS

IP.com Disclosure Number: IPCOM000009762D
Original Publication Date: 2000-May-01
Included in the Prior Art Database: 2002-Sep-17
Document File: 2 page(s) / 119K

Publishing Venue

Motorola

Related People

Authors:
Iwona Turlik Cindy Melton Dan Gamota

Abstract

Currently, solder based flip chip bumps on IC bond pads are deposited either by evaporation, plating, thermo-compression bonding (stud bump bonding) or stencil printing (Figure 1). In order to form a robust bond to the aluminum IC bond pad, additional solder wettable layers are added to the IC bond pad e.g. TiW, Au.