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Browse Prior Art Database

ENHANCE SELF ALIGNMENT DIRECT CHIP ATTACH

IP.com Disclosure Number: IPCOM000009819D
Original Publication Date: 2000-May-01
Included in the Prior Art Database: 2002-Sep-20
Document File: 3 page(s) / 189K

Publishing Venue

Motorola

Related People

Authors:
CL Wong

Abstract

The present DCA process using the Control Collapse Chip Connection (C4) technology requires pre-deposited solder on the DCA site on the Printed Circuit Board (PCB). The solder deposit on the DCA site on the PCB is typically flattened. (Figure 1). In DCA process, the DCA site on the PCB is first fluxed, then the flip chip die is placed on the PCB with the corresponding flip chip bumps sitting on the pre-deposited solder bumps and lastly the assembly is reflowed.