ENHANCE SELF ALIGNMENT DIRECT CHIP ATTACH
Original Publication Date: 2000-May-01
Included in the Prior Art Database: 2002-Sep-20
The present DCA process using the Control Collapse Chip Connection (C4) technology requires pre-deposited solder on the DCA site on the Printed Circuit Board (PCB). The solder deposit on the DCA site on the PCB is typically flattened. (Figure 1). In DCA process, the DCA site on the PCB is first fluxed, then the flip chip die is placed on the PCB with the corresponding flip chip bumps sitting on the pre-deposited solder bumps and lastly the assembly is reflowed.