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METHOD FOR IMPROVING THE RELIABILITY OF BALL GRID ARRAY DEVICES ON FR4 PRINTED CIRCUIT BOARDS

IP.com Disclosure Number: IPCOM000009828D
Original Publication Date: 2000-May-01
Included in the Prior Art Database: 2002-Sep-20

Publishing Venue

Motorola

Related People

Authors:
Jay R. Mitchell

Abstract

This paper describes a method for improving the reliability of Ball Grid Array (BGA) devices on FR4 Printed Circuit Boards (PCB ), by laminating a thin, relatively compliant layer of material on the component side of the PCB between the BGA and the intemal FR4 layers thus relieving the stress build up in the BGA solder joints during thermal cycling.