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X-PATTERNED GOLD DIE CAVITY Disclosure Number: IPCOM000009868D
Original Publication Date: 2000-May-01
Included in the Prior Art Database: 2002-Sep-25

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Eliatamby Nadarajah


A Pin Grid Array hermetic package (PGA) is used to house many different devices, including the 68000 series microprocessors, digital signal processors and RJSC. This type of PGA is a ceramic package with a gold only internal die cavity area which uses silver glass paste as the die attach material.