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Method for an electronic packaging substrate with unlanded and/or uncovered vias

IP.com Disclosure Number: IPCOM000009883D
Publication Date: 2002-Sep-25
Document File: 4 page(s) / 64K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an electronic packaging substrate with unlanded and/or uncovered vias. Benefits include improved power performance and improved design flexibility.