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Disclosed is a method to protect IC components or assemblies during handling, storage and transport. Benefits include better component protection and reduced implementation costs.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
50% of the total text.
Low Cost Design to Bulk Handle,
Transport, or Store IC Components and/or Assembly Packages
Disclosed is a method to protect IC components or assemblies during
handling, storage and transport. Benefits include better component protection
and reduced implementation costs.
Existing technologies use injection molded trays (JEDEC style) that are
one piece with a thermoformed closed bottom. Industry unloading practices for
most components and assemblies is accomplished via manual handling. Components
are loaded into JEDEC tray via automated equipment, but unloading is usually
done by hand. JEDEC style trays require tray and component/assembly handling
that results in finger contact on sensitive features.� The result is frequent damage to components or assemblies.
The disclosed method uses two trays, with only one tray
required during line handling (see Figure 1). The location and combination of
features will vary with component or assembly profile.� See Figures 2 through 6 for current state of
the art and assembled and loaded configurations of the disclosed method.
When two trays are placed together (mated open face-to-face)
180 degrees rotated end-to-end, the protruding features of one are nested in
corresponding pocket features on the opposing tray.� This configuration forms a complete box around the
components/assemblies. Likewise, if the back face is mated to another back
face, rotated 180 degrees to each other, the features on those faces nest in
each other, allowing for multiple sets...