Substrate Soldermask Barrier and Trough to Control Die Attach Bleed Out for all Die to Substrate Applications
Publication Date: 2002-Oct-02
The IP.com Prior Art Database
Disclosed is a method for creating a control barrier to prevent die attach bleed out. The method prevents bleed out by applying additional soldermask, or by creating a trough in the soldermask. Benefits include improved assembly yield and an increase in wirebound reliability.