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Substrate Soldermask Barrier and Trough to Control Die Attach Bleed Out for all Die to Substrate Applications

IP.com Disclosure Number: IPCOM000009964D
Publication Date: 2002-Oct-02

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for creating a control barrier to prevent die attach bleed out. The method prevents bleed out by applying additional soldermask, or by creating a trough in the soldermask. Benefits include improved assembly yield and an increase in wirebound reliability.