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Method for thermal enhancement of low-profile packages by utilizing EMI metal shielding or a metal heat spreader

IP.com Disclosure Number: IPCOM000009965D
Publication Date: 2002-Oct-02
Document File: 4 page(s) / 269K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for thermal enhancement of low-profile packages by utilizing electromagnetic interference (EMI) metal shielding or a metal heat spreader. Benefits include improved thermal performance.