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Disclosed is a method for the use of press molds to create cavity features in thermoset dielectrics. Benefits include improved functionality, improved ease of manufacturing, and improved reliability.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
81% of the total text.
Method for the use of press molds to create cavity features
in thermoset dielectrics
Disclosed is a method for the use of press molds to create
cavity features in thermoset dielectrics. Benefits
include improved functionality, improved ease of manufacturing, and improved
� � � � � To achieve the
thinner packages required for small, thin applications, the stack height of
substrate packages must be reduced.
� � � � � Conventionally, pads and die reside above the dielectric
layer (see Figures 1 and 2). The use of solder resist defines the pad size.
� � � � � The disclosed method is the creation of cavities in substrates through custom design press molds in
thermoset dielectric lamination during the substrate build-up processes. Cavities
in the dielectric are created for the pads and die to reside (see Figures 3 and
� � � � � The key elements of the disclosed method include:
• � � � � Substrate stack-up reduction with wirebond
pads, bump pads, and a die residing in the cavity
• � � � � Custom design of a press mold, pending
substrate layout designs
• � � � � No change to the overall current dielectric
final thickness post lamination
• � � � � Solder resist not required for this
application because of nickel and gold plated pads