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Probe Attachment Mechanism for Measurement of Heat-sinked Components

IP.com Disclosure Number: IPCOM000009968D
Publication Date: 2002-Oct-02

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for creating a probe attachment mechanism (PAM) test tool that measures the surface temperature beneath the heat sink of packages and board surfaces. The disclosed method requires no glue or extensive preparation, and it also improves the accuracy of measuring temperatures.