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Method for a mold pattern to enable solder printing onto 300-mm wafers down to 100-micron pitch

IP.com Disclosure Number: IPCOM000010019D
Publication Date: 2002-Oct-09

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a mold pattern to enable solder printing onto 300-mm wafers down to 100-micron pitch. Benefits include improved functionality and improved reliability.