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Apparatus for Determining Via Plug Fill Percent w/o use of X-section:

IP.com Disclosure Number: IPCOM000010022D
Publication Date: 2002-Oct-09

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a coupon configuration to measure the fill percent of the plugging material in vias after the plugging process. Benefits include real-time measurements without taking a cross section.