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ACIDIC/ALKALINE DIAMOND SLURRY FOR USE IN CHEMCIAL / MECHANICAL PLANARIZATION OF SEMI-CONDUCTOR WAFERS

IP.com Disclosure Number: IPCOM000010026D
Publication Date: 2002-Oct-09

Publishing Venue

The IP.com Prior Art Database

Abstract

A stable, well-dispersed suspension formulation comprising diamond micron powder with a specially formulated mixture of water and organic compounds for use in lapping applications for semiconductor wafers / the chemical mechanical planarization of semiconductor circuits, for superior removal rates and surface finishes relative to the currently available silicon and alumina slurries.