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Method for a preapplied substrate load redistributor with cavity pads for C4 interconnection

IP.com Disclosure Number: IPCOM000010061D
Publication Date: 2002-Oct-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a preapplied substrate load redistributor with cavity pads for controlled collapse chip collect (C4) interconnection. Benefits include improved productivity and improved performance.