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Thin Board Apparatus to Measure Via Plug Fill Percent

IP.com Disclosure Number: IPCOM000010070D
Publication Date: 2002-Oct-16
Document File: 3 page(s) / 45K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a thin board apparatus which can be fully or partially processed in the same manner as a PCB, with a thickness that matches the via fill percent to be tested in PCB boards. Benefits include correcting filling process errors before the plugging material has cured.