Dismiss
InnovationQ will be updated on Sunday, September 22, from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method for bond pads over redistribution layers for wire bonding

IP.com Disclosure Number: IPCOM000010073D
Publication Date: 2002-Oct-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for bond pads over redistribution layers (RDLs) for wire bonding (WB). Benefits include improved reliability.