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Method for Incorporating Passive Components into FSBGA and Asymmetric FSBGA Folded (Stackable) Ball Grid Array Packages

IP.com Disclosure Number: IPCOM000010108D
Publication Date: 2002-Oct-23

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for attaching passive components (e.g. capacitors, inductors, resistors, etc.) in two areas: · For FSBGA packages, into the area folded together · For asymmetric FSBGA packages, onto the asymmetric flap Benefits include keeping components out of the way and closer to the die in the folded package.