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Method for eliminating the requirement for wirebonding over PI/BCB layers during wirebond in a wirebond-to-wirebond RDL application

IP.com Disclosure Number: IPCOM000010169D
Publication Date: 2002-Oct-30
Document File: 3 page(s) / 40K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for eliminating the requirement for wirebonding over polymide/benzocyclobutene (PI/BCB) layers during wirebond in a wirebond-to-wirebond redistribution layer (WB-WB RDL) application. Benefits include improved ease of manufacturing.