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Method for a package landside and motherboard cap clearance socket

IP.com Disclosure Number: IPCOM000010177D
Publication Date: 2002-Oct-30
Document File: 2 page(s) / 64K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a package landside and motherboard cap clearance socket. Benefits include improved electrical performance and improved ease of manufacturing.