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Concept Search - What can I type?
For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.
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Disclosed is a method for a package landside and motherboard cap clearance socket. Benefits include improved electrical performance and improved ease of manufacturing.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
Method for a package landside and motherboard cap clearance
Disclosed is a method for a package landside and motherboard cap clearance socket. Benefits include improved electrical performance and
improved ease of manufacturing.
� � � � � The disclosed method is a CPU socket that provides sufficient
clearance to accommodate taller and higher-density capacitors in the socket
cavity on the motherboard and package (see Figure 1). This solution is
achieved by changing the socket height while maintaining the same length and
� � � � � The disclosed method improves electrical performance by
enabling higher-density cost-effective capacitors in the socket cavity (see
Figure 2) and/or under the package (see Figure 3).
� � � � � The use of higher-density capacitors reduces the number of
capacitors required and enables the use of one size of capacitor for the entire
board, improving beat rate and board through-put time.