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Stamped Array Metal Core for HDI Substrates

IP.com Disclosure Number: IPCOM000010181D
Publication Date: 2002-Oct-30
Document File: 3 page(s) / 140K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a metal core (for CPU and other HDI organic substrates) with a standard punched array of holes. The holes of the metal core are positioned to provide complete flexibility for a multitude of routing designs using the same core.