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Alternative Method for Creating the Second Level Interconnects on a BGA Package

IP.com Disclosure Number: IPCOM000010182D
Publication Date: 2002-Oct-30

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a pre-formed sheet of solder spheres embedded in a phase change flux. The pre-formed sheet contains the specific interconnect pattern for a given device, controlling the pitch and true position of the spheres. Benefits include improved process yields and higher UPH.